TE Connectivity 1374463-4 Ficha de datos descargar pdf (Pagina 57)

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FIBER

Fiber

Fiber Enclosures

RMG/AMP NETCONNECT

• Modular solution (LGX* footprint)

• Single chassis for all applications

• Simple design, economical

* LGX is a registered trademark

TFP

• Medium Feature – Lower density for better connector access

• Modular solution (Unique TE footprint)

• Single chassis for all applications

Q3000

• High feature with manageable density

• Uses blades as user interface

• Addresses termination/MPO applications in same chassis

Fiber Enclosure Comparison

Universal Connectivity Platform

• High versatility with excellent value

• Modular solution for both copper and fiber cassettes

• High density (96fibers in 1U)

High Density Equipment Panel

• Most advanced cable management – highest manageable density

• Interchangeable modules for full 10/40/100 migration

• MPOptimate compatible

• Managed and unmanaged

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TE Connectivity 1374463-4 Ficha de datos Pagina 57